Adopting SIP (System-in-Package) technology to achieve miniaturization of PCBA (Printed Circuit Board Assembly).
High-strength, high-modulus materials (including plastics and lightweight metals) ensure superior stability and deformation resistance.
Integration of plant-based components strengthens the product’s eco-friendly attributes.
Innovative system architecture design featuring a dual-system setup of SOC and MCU, enhancing standby duration and user experience.